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this is information on a product in full production. may 2014 docid023936 rev 2 1/14 STL13DP10F6 dual p-channel 100 v, 0.136 typ., 3.3 a stripfet? vi deepgate? power mosfet in a powerflat? 5x6 double island datasheet - production data figure 1. internal schematic diagram features ? r ds(on) * q g industry benchmark ? extremely low on-resistance r ds(on) ? high avalanche ruggedness ? low gate drive power losses applications ? switching applications description this device is a dual p-channel power mosfet developed using the 6 th generation of stripfet? deepgate? technology, with a new gate structure. the resulting power mosfet exhibits the lowest r ds(on) in all packages. powerflat? 5x6 double island 1 4 8 5 1 4 order code v ds r ds(on) max. i d STL13DP10F6 100 v 0.18 ? 3.3 a table 1. device summary order code marking packages packaging STL13DP10F6 13dp10f6 powerflat? 5x6 double island tape and reel www.st.com
contents STL13DP10F6 2/14 docid023936 rev 2 contents 1 electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 electrical characteristics (curves) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3 test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 4 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 5 revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 docid023936 rev 2 3/14 STL13DP10F6 electrical ratings 14 1 electrical ratings note: for the p-channel power mosfet the actual polarity of the voltages and the current must be reversed. table 2. absolute maximum ratings symbol parameter value unit v ds drain-source voltage 100 v v gs gate-source voltage 20 v i d (1) 1. the value is rated according r thj-c drain current (continuous) at t c = 25 c 13 a i d (1) drain current (continuous) at t c = 100 c 7.3 a i d (2) 2. the value is rated according r thj-pcb drain current (continuous) at t pcb = 25 c 3.3 a i d (2) drain current (continuous) at t pcb =100c 2 a i dm (2) , (3) 3. pulse width limited by safe operating area drain current (pulsed) 13.2 a p tot (1) total dissipation at t c = 25c 62.5 w p tot (2) total dissipation at t pcb = 25c 4 w t j t stg operating junction temperature storage temperature -55 to 150 c table 3. thermal resistance symbol parameter value unit r thj-case thermal resistance junction-case 2 c/w r thj-pcb (1) 1. when mounted on fr-4 board of 1inch2, 2oz cu, t < 10 sec thermal resistance junction-pcb 32 c/w electrical characteristics STL13DP10F6 4/14 docid023936 rev 2 2 electrical characteristics (t case =25 c unless otherwise specified) table 4. on/off states symbol parameter test conditions min. typ. max. unit v (br)dss drain-source breakdown voltage v gs = 0, i d = 250 a 100 v i dss zero gate voltage drain current v gs = 0, v ds = 100 v 1 a v gs = 0, v ds = 100 v, t c =125 c 10 a i gss gate body leakage current v ds = 0, v gs = 20 v 100 na v gs(th) gate threshold voltage v ds = v gs , i d = 250 a 24v r ds(on) static drain-source on- resistance v gs = 10 v, i d = 1.7 a 0.136 0.18 ? table 5. dynamic symbol parameter test conditions min. typ. max. unit c iss input capacitance v ds =25 v, f=1 mhz, v gs =0 -864 - pf c oss output capacitance - 45 - pf c rss reverse transfer capacitance -25 - pf q g total gate charge v dd =50 v, i d = 3.3 a v gs =10 v (see figure 14 ) - 16.5 - nc q gs gate-source charge - 3.5 - nc q gd gate-drain charge - 3.8 - nc table 6. switching times symbol parameter test conditions min. typ. max. unit t d(on) turn-on delay time v dd =50 v, i d = 1.7 a, r g =4.7 , v gs =10 v (see figure 13 ) - 10.5 - ns t r rise time - 4.8 - ns t d(off) turn-off delay time - 24 - ns t f fall time - 4.5 - ns docid023936 rev 2 5/14 STL13DP10F6 electrical characteristics 14 note: for the p-channel power mosfet the actual polarity of the voltages and the current must be reversed. table 7. source drain diode symbol parameter test conditions min. typ. max. unit i sd source-drain current - 3.3 a i sdm (1) 1. pulse width limited by safe operating area source-drain current (pulsed) - 13.2 a v sd (2) 2. pulsed: pulse duration=300 s, duty cycle 1.5% forward on voltage i sd = 3.3 a, v gs =0 -1.1v t rr reverse recovery time i sd = 3.3 a, di/dt = 100 a/ s, v dd =80 v, t j =150 c -26.5 ns q rr reverse recovery charge - 36.5 nc i rrm reverse recovery current - 2.7 a electrical characteristics STL13DP10F6 6/14 docid023936 rev 2 2.1 electrical characteristics (curves) figure 2. safe operating area figure 3. thermal impedance figure 4. output characteristics figure 5. transfer characteristics figure 6. gate charge vs gate-source voltage figure 7. static drain-source on-resistance , ' 9 ' 6 9 $ 2 s h u d w l r q l q w k l v d u h d l v / l p l w h g e \ p d [ 5 ' 6 r q p v p v ? v 7 m ? & 7 s f e ? & 6 l q j o h s x o v h * , 3 * 6 $ 6 l q j o h s x o v h g . w s v q d c * , 3 * 6 $ , ' 9 ' 6 9 $ 9 9 9 * 6 9 9 * , 3 * 6 $ , ' 9 * 6 9 $ 9 ' 6 9 * , 3 * 6 $ 9 * 6 4 j q & |